Akasa Pi-5 Pro - Aluminum Raspberry Pi 5 Enclosure

SparkFun

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SKU:
057-PRT-30976
MPN:
PRT-30976
Aluminium fanless Raspberry Pi 5 enclosure with passive heat sink design and full board protection
Fanless aluminium enclosure for Raspberry Pi 5 with passive heat sink design. Provides silent cooling improved thermal performance and full board protection for industrial and embedded applications. View full description
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₹4,617.68 inc. GST
₹3,913.29 ex. GST
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Technical Specifications

Brand:
SparkFun
Product Type:
Aluminium Enclosure
Cooling Method:
Passive Heat Sink
Material:
Aluminium
Compatibility:
Raspberry Pi 5
Thermal Interface:
Integrated Thermal Pads
Cooling Type:
Fanless
Noise Level:
Silent Operation
Enclosure Type:
Fully Enclosed
Access:
I O And GPIO Accessible
Application:
Embedded Systems Industrial Automation Edge Computing

Warranty Information

All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.

Description

Resources:

Fanless Aluminium Raspberry Pi 5 Enclosure With Passive Heat Sink Design For Silent And Reliable Thermal Management

The Sparkfun Pi 5 Pro aluminium enclosure is engineered for efficient passive cooling of Raspberry Pi 5 systems without the need for active fans. Constructed from solid aluminium, the enclosure acts as a heat sink, transferring heat away from the processor through integrated thermal pads. This ensures stable performance during extended workloads while maintaining completely silent operation, making it ideal for noise sensitive and continuous run environments.

Its fully enclosed design offers enhanced protection for the board while still providing precise access to all essential I O headers and connectors. The compact industrial form factor makes it suitable for embedded systems, edge computing, automation, and industrial control setups. With no moving parts, the enclosure improves long term reliability and reduces maintenance requirements in 24 7 deployments.

Key Features

  • Fanless Cooling Design: Passive heat dissipation with no moving parts ensures silent operation
  • Aluminium Heat Sink Body: Solid aluminium enclosure efficiently transfers heat away from CPU
  • Thermal Pad Integration: Direct contact heat transfer from processor to enclosure surface
  • Improved Thermal Performance: Reduces overheating and thermal throttling under load
  • Full Enclosure Protection: Shields Raspberry Pi board from dust and physical damage
  • I O Accessibility: Precise cutouts for all ports and GPIO access
  • Compact Form Factor: Space efficient design for embedded and industrial applications
  • High Reliability: Suitable for continuous 24 7 operation without active cooling

 

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