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Radxa ROCK 3B Pico-ITX Single Board Computer

Radxa

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SKU:
498-RS118-D2E0J0
MPN:
RS118-D2E0J0
Radxa ROCK 3B is a compact Pico-ITX SBC powered by Rockchip RK3568, featuring Cortex-A55 CPU, Mali-G52 GPU, AI NPU (1 TOPS), 4K UHD support, and wide-temp industrial-grade variant for reliable edge computing and automation. View full description
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Technical Specifications

Brand:
Radxa
SoC:
Rockchip RK3568
CPU:
Quad‑core Arm® Cortex™‑A55 (Armv8) 64‑bit @ 2.0GHz
GPU:
Arm® Mali™ G52 GPU - OpenGL® ES 1.1 / 2.0 / 3.2 - OpenCL™ 2.0 - Vulkan® 1.1
NPU:
1 TOPs @ INT8 / INT16 / FP16 / BFP16 MAC hybrid operation Support deep-learning frameworks: TensorFlow, TF-lite, Pytorch, Caffe, ONNX, MXNet, Keras, Darknet
Multimedia:
H.265 / H.264 / VP9 video decoder up to 4K@60fps H.264 / H.265 video encoder up to 1080@60fps
RAM:
2 / 4 GB 32bits LPDDR4
Storage:
1x eMMC connector 1x M.2 M Key (2‑lane PCIe 3.0) supporting NVMe SSD 1x Micro SD(TF) card slot
Display:
1x Standard HDMI 2.0 supporting displays up to 4Kp60 resolution 1x 2‑lane MIPI DSI supporting displays up to 2Kp60 resolution
Camera:
1x 2-lane MIPI CSI for camera
Ethernet:
1x Gigabit Ethernet port supports PoE with PoE HAT
USB:
1x USB3.0 HOST port 1x USB3.0 OTG/HOST port 2x USB2.0 HOST ports
Audio:
1x 4‑ring 3.5mm Headphone Jack
Software:
Debian Linux support Android 11 support
Power Requirements:
- USB Type‑C PD V2.0 supporting 9V/2A, 12V/2A, 15V/2A and 20V/2A. - Qualcomm Quick Charge 2.0 QC3.0/2.0 adapter 9V/2A and 12V/1.5A. - 5V Power applied to the GPIO PIN 2 & 4
Operating Conditions:
Recommended environmental temperature: 0 ~ 50°C
Dimension:
85 mm x 56 mm

Warranty Information

All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.

Description

Radxa ROCK 3B: Power-Packed Industrial SBC for High-Performance Edge Computing

Elevate your industrial and embedded computing applications with the Radxa ROCK 3B, a cutting-edge single board computer engineered on the compact Pico-ITX form factor (100 mm x 75 mm). This high-efficiency platform is built around the Rockchip RK3568(J) processor featuring a 22nm lithography process that delivers an ideal balance of performance, power efficiency, and lightweight AI computing capabilities. Available in both Community and Industrial Editions, the ROCK 3B is purpose-built to meet diverse requirements — from developer innovation to rugged industrial deployments requiring extended temperature tolerance and mechanical robustness.

Powered by a quad-core Arm Cortex-A55 CPU and Mali-G52 GPU, the ROCK 3B is optimized for stunning visual experiences and low-latency AI tasks. Its integrated Neural Processing Unit (NPU) supports deep learning frameworks and offers up to 1 TOPS processing performance, making it a perfect solution for edge AI computing, industrial automation, IoT deployments, and smart display solutions. This board not only supports 4K Ultra HD output and multi-monitor capabilities, but also enables developers to bring powerful ideas to life with high responsiveness and flexibility.

Key Features of Radxa ROCK 3B

  • Compact and Compatible Design
    Pico-ITX form factor (100 mm x 75 mm) ensuring seamless integration across embedded and industrial systems.

  • High-Efficiency CPU Architecture
    Powered by Quad-core Arm Cortex-A55, clocked up to 2.0GHz for multitasking and efficient load handling.

  • Advanced Graphics Processing
    Mali-G52 2EE GPU supports OpenGL ES 1.1/2.0/3.0/3.1/3.2, OpenCL 2.1, and Vulkan 1.1 for exceptional visual output and energy-efficient performance.

  • Integrated AI NPU Acceleration
    Supports up to 1 TOPS AI inference speed with deep learning framework compatibility, ideal for AI vision and automation projects.

  • 4K UHD and Multi-Display Support
    Supports ultra-high-resolution output and multi-monitor configurations, ideal for digital signage and complex industrial dashboards.

  • Industrial Grade Variant
    Tailored for harsh environments with wide temperature range tolerance, mechanical durability, and enhanced reliability.

  • Energy Efficient Design
    Built on 22nm lithography, reducing heat and power consumption while extending operational lifespan and performance sustainability.

  • Versatile Interface Options
    Rich I/O and connectivity options enabling easy integration into diverse applications including smart edge devices and robotics.

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