Resources:
Seeed Studio XIAO ESP32C3 is an ultra-compact development board that features a highly-integrated ESP32-C3 chip, which is based on a 32-bit RISC-V processor with a four-stage pipeline operating at speeds of up to 160 MHz. This board is ideal for Internet of Things (IoT) applications, offering both Wi-Fi and Bluetooth Low Energy (BLE) wireless connectivity.
The ESP32-C3 chip provides complete 2.4GHz Wi-Fi capabilities, supporting Station mode, SoftAP mode, SoftAP & Station mode, and promiscuous mode for various Wi-Fi applications. It is also equipped with Bluetooth 5 and Bluetooth mesh support, making it versatile for IoT scenarios. With 400 KB SRAM and 4 MB Flash on the chip, it offers ample programming space for IoT control applications.
The board maintains the classic thumb-sized form factor and features a battery charge chip and integrated circuit for enhanced portability. It comes with an external antenna to boost wireless signal strength. Additionally, it provides 11 digital I/O pins for PWM and 4 analog I/O pins for ADC. It supports UART, IIC, and SPI serial communication, making it suitable for a wide range of applications, including wearable and portable devices.
Please note that the pins are not included with this product and should be purchased separately.
Key Features:
- Highly-Integrated MCU Board: Incorporates the ESP32-C3 32-bit RISC-V chip, operating at up to 160 MHz, and features multiple development ports with support for Arduino and CircuitPython.
- Excellent RF Performance: Provides complete Wi-Fi and BLE functionality and supports communication over a range of 100 meters with a U.FL antenna.
- Advanced Power Management: Offers four working modes, with power consumption as low as 44 mA in deep sleep mode, and includes lithium battery charge management.
- Compact Design: The board measures 21x17.5mm, adhering to the classic Seeed Studio XIAO series form factor, making it suitable for wearable devices.
- Ideal for Production: Designed to be breadboard-friendly with an SMD design and no components on the back.
Hardware Overview
