Active Aluminium Heatsink With Tower-Style Fins And Low-Profile Mounting For Radxa ROCK 5 Series SBCs
The Radxa Heatsink 4025A is an active cooling solution specifically designed for the Radxa ROCK 5B, ROCK 5B+, and ROCK 5T single-board computers. Its aluminium profile uses tower-style three-dimensional fins to increase the available heat-dissipation surface area while improving airflow around the heatsink. The integrated active cooling design helps manage processor temperatures during sustained workloads, development, edge-computing applications, and other thermally demanding use cases.
A low-profile spring fastening system helps provide sufficient clearance around the board and reduces interference with installed NVMe storage. Installation uses dedicated mounting points and supplied thermal pads to establish effective thermal contact with the SoC and surrounding area. On the ROCK 5T, the heatsink can also be installed alongside the Radxa 25W PoE+ Module 5514, enabling compatible systems to combine active cooling with power and network data through a single Ethernet connection.
Key Features
- Designed For ROCK 5 Series: Specifically developed for Radxa ROCK 5B, ROCK 5B+, and ROCK 5T boards.
- Active Cooling Design: Integrated fan assists airflow through the heatsink for improved thermal management.
- Aluminium Construction: Aluminium profile provides efficient heat transfer from the board to the cooling fins.
- Tower-Style 3D Fins: Three-dimensional fin structure increases the effective heat-dissipation surface area.
- Improved Airflow: Fin geometry is designed to allow cooling air to move efficiently through the heatsink structure.
- 40 x 25 mm Cooling Format: Radxa documentation identifies the 4025A as a 40 x 25 mm active cooling heatsink.
- Low-Profile Spring Fastener: Helps maintain secure contact while reducing interference with nearby components.
- NVMe-Friendly Clearance: Low-profile fastening helps address clearance issues between the heatsink and compatible NVMe SSD installations.
- Direct SoC Thermal Contact: Includes a dedicated 22 x 22 x 0.8 mm thermal pad for the processor.
- Additional Thermal Pad: Includes a 40 x 40 x 1.0 mm pad for insulation and additional thermal management around the SoC area.
- Board-Specific Mounting: Aligns with the dedicated heatsink mounting holes on compatible ROCK 5 boards.
- Push-Pin Installation: Uses integrated mounting pins for straightforward installation without a complex mounting frame.
- ROCK 5T PoE+ Compatibility: Can be installed simultaneously with the Radxa 25W PoE+ Module 5514 on ROCK 5T.
- Suitable For Sustained Workloads: Useful for systems running CPU-intensive, AI, server, networking, compilation, or continuous-processing workloads.
- Official Radxa Accessory: Designed around the physical layout and mounting points of supported Radxa ROCK 5 boards.
Applications
- Radxa ROCK 5B cooling
- Radxa ROCK 5B+ cooling
- Radxa ROCK 5T cooling
- Edge-computing systems
- AI and machine-learning projects
- Home servers
- Network appliances
- Industrial embedded systems
- Robotics controllers
- Software compilation
- Media-processing systems
- Development workstations
- Continuous-operation SBC systems
- NVMe-based ROCK 5 projects
- PoE-powered ROCK 5T systems
- High-load embedded applications
Heatsink Specialized for Radxa
ROCK 5B / 5B+ / 5T
The aluminum profile combined with tower-style three-dimensional fins significantly increases the heat
dissipation area and improves airflow efficiency
Low-Profile Spring Fastener
Ensures proper clearance to resolve interference between the heatsink and NVMe SSDs effectively
Radxa 25W PoE+ Module 5514
The Radxa ROCK 5T supports simultaneous heatsink and PoE+ integration, delivering power and data
through a single cable to streamline wiring
Package List:
- 1x Heatsink 4025A
- 1x Thermal pad (22x22x0.8 mm)
- 1x Thermal pad (40x40x1.0 mm)
