DA14531 SmartBond Tiny Module Bluetooth 5.1 Cortex-M0+ 48kB RAM 1Mb Flash

The DA14531 SmartBond TINYTM Module is based on DA14531 SoC bluetooth Low energy module designed by Dialog Semiconductor. The module is designed to enable the use of Bluetooth Low Energy in applications where Bluetooth Low Energy could not be used until now because of cost or complexity. The bigger picture is to drive Bluetooth Low Energy technology into every application, turning every product into a connected IoT node to drive the next 1 billion IoT devices in the market. The SmartBond TINYTM Module is supported by software that is easy to work with. This lowers the threshold to use Bluetooth Low Energy technology and significantly speeds up the design time. The module comes with a configurable DSPS (serial port service) and next generation Codeless software to design Bluetooth applications without Bluetooth knowledge or advanced programming skills.

• Bluetooth
  
  • Compatible with Bluetooth v5.1, ETSI EN 300 328 and EN 300 440 Class 2 (Europe), FCC
  • CFR47 Part 15 (US) and ARIB STD-T66 (Japan) core
  • Supports up to 3 connections
  • Dialog Semiconductor registered BD address preprogrammed in OTP
• Processing and memories
  
  • 16 MHz 32-bit Arm Cortex M0+ with SWD interface
  • 128 Kbytes internal FLASH
  • 48 Kbytes RAM
  • 144 Kbytes ROM
  • 32 Kbytes OTP
• Current Consumption
  
  • 2 mA RX at VBAT=3V
  • 4 mA TX at VBAT=3V and 0 dBm
  • 1.8 µA at sleep with all RAM retained
• Radio
  
  • Programmable RF transmit power from -19 to +2.2 dBm
  • -93 dBm receiver sensitivity
• Interfaces
  
  • Quadrature decoder with 3 channels
  • 3 channel 11-bit ENOB ADC
  • 2 general purpose timers with PWM
  • 9 GPIOs
  • SPI
  • 2x UART, 1-wire UART support
  • I2C
• Power Management
  
  • Operating range (1.8 V - 3.3 V)
  • Inrush current control
• Other
  
  • Real Time Clock
  • Trimmed 32 MHz Crystal
• Packaging
  
  • 12.5 mm x 14.5 mm x 2.8 mm package

• DA14531 SmartBond Tiny Module Product Brief
• DA14531 Module Datasheet