Technical Specifications
Warranty Information
All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.
All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.
The 7Semi SX1278 RA-02 LoRa Breakout is a high-performance wireless transceiver module tailored for long-range, low-power wireless communication applications. Operating across the 410MHz to 525MHz frequency band, this module offers robust and secure data transmission using advanced LoRa technology. It supports a wide range of modulation techniques including FSK, GFSK, MSK, GMSK, LoRa, and OOK, making it ideal for varied IoT deployments and industrial wireless networks. Whether you're building an agricultural sensor network or a smart city infrastructure, this breakout board ensures superior coverage and connectivity.
Designed for energy efficiency and reliable performance, the SX1278 RA-02 runs on 3.3V and offers a maximum output power of +20dBm. Its ultra-low receiving current of 12.15mA and standby current of just 1.6mA make it perfect for battery-powered devices. The module uses SPI communication with a half-duplex interface and includes a 256-byte packet engine with CRC for secure data handling. Its high sensitivity, reaching as low as -140dBm, ensures dependable signal reception even in challenging environments.
Key Features:
Wide Frequency Range: Operates between 410MHz to 525MHz, suitable for sub-GHz communication needs.
Versatile Modulation Support: Compatible with FSK, GFSK, MSK, GMSK, LoRa, and OOK for flexible protocol integration.
High Output Power: Delivers up to +20dBm output for extended range in open and urban environments.
Low Power Consumption: Efficient design with 12.15mA receive current and 1.6mA standby current, ideal for low-power IoT applications.
Advanced Packet Engine: Built-in 256-byte FIFO with CRC for reliable data transmission.
High Sensitivity: Achieves up to -140dBm, enhancing long-distance communication capabilities.
SPI Interface: Seamless integration with microcontrollers and embedded systems via SPI communication.
Compact Design: Easy to integrate into custom PCB designs or breadboard setups for prototyping and production.