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STM32F103ZCT6 - 32-bit ARM Cortex-M3 Microcontroller 256KB Flash 144-Pin LQFP

STMicroelectronics

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SKU:
033-STM32F103ZCT6
MPN:
STM32F103ZCT6
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₹495.00 ex. GST
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Technical Specifications

Brand:
STMicroelectronics
Case/Package:
LQFP
Number of Pins:
144
Core Architecture:
ARM
Data Bus Width:
32 b
Density:
256 kB
Frequency:
72 MHz
Interface:
I2C , SPI , USB , CAN , IrDA , UART , USART , LIN , I2S , SDIO
Max Frequency:
72 MHz
Max Operating Temperature:
85 C
Max Power Dissipation:
666 mW
Max Supply Voltage:
3.6 V
Memory Size:
256 kB
Memory Type:
FLASH
Min Operating Temperature:
-40 C
Min Supply Voltage:
2 V
Number of ADC Channels:
21
Number of Bits:
32
Number of I/Os:
112
Number of I2C Channels:
2
Number of PWM Channels:
16
Number of Programmable I/O:
112
Number of SPI Channels:
3
Number of Timers/Counters:
8
Oscillator Type:
Internal
Peripherals:
POR , PWM , WDT , DMA , Temp Sensor , I2C
RAM Size:
48 kB
Termination:
SMD/SMT
Watchdog Timer:
Yes
Height:
1.45 mm
Length:
20 mm
Width:
20.2 mm
Lead Free:
Lead Free
REACH SVHC:
No SVHC
Radiation Hardening:
No
RoHS:
Compliant

Warranty Information

All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.

Description

Datasheet

The STM32F103xC, STM32F103xD and STM32F103xE performance line family incorporates the high-performance ARM Cortex -M3 32-bit RISC core operating at a 72 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 64 Kbytes), and an extensive range of enhanced I/Os and peripherals connected to two APB buses. All devices offer three 12-bit ADCs, four general-purpose 16-bit timers plus two PWM timers, as well as standard and advanced communication interfaces: up to two I2Cs, three SPIs, two I2Ss, one SDIO, five USARTs, an USB and a CAN.

    1 Reviews

  • Posted by Husnain on 22nd Feb 2021

    4

    STM arm Microcontrollers

    The follow up delivery was prompt.However, the packing would be better and ic placesd between hard package instead of soft