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SparkFun Micro/Triple Axis Accelerometer Breakout – LIS3DH (Qwiic): Low-Power 3DoF Motion Sensing
The SparkFun Triple Axis Accelerometer Breakout – LIS3DH (Qwiic) is a compact, Qwiic-enabled board featuring the LIS3DH, a low-power 3-axis capacitive MEMS accelerometer from STMicroelectronics. With 12-bit resolution, selectable full-scale ranges (2g/4g/8g/16g), and multiple built-in motion detection capabilities, this sensor is ideal for adding translation and movement detection to your project. Classified as a 3DoF sensor, it can be combined with gyroscopes or magnetometers for a full IMU setup.
This updated version features a 1in × 1in Qwiic form factor with dual Qwiic connectors for solder-free integration into SparkFun’s Qwiic ecosystem. The breakout also supports both I²C and SPI interfaces, allowing flexible system integration. With features like free-fall detection, 6D/4D orientation sensing, motion interrupts, and an embedded temperature sensor, the LIS3DH is well-suited for robotics, wearables, handheld devices, and IoT applications.
Note: This is a 3.3V device. Voltages above 3.6V can damage the IC. Use directly with 3.3V systems or include level shifting for SPI with 5V boards.
Key Features
Low-Power 3-Axis Accelerometer: Based on the STMicroelectronics LIS3DH.
Resolution: 12-bit digital output for precise acceleration measurement.
Selectable Full-Scale Range: 2g, 4g, 8g, 16g.
Interfaces: Supports both I2C and SPI communication.
Operating Voltage: 1.7V–3.6V (3.3V recommended).
Qwiic-Enabled: Dual Qwiic connectors for easy daisy-chaining and solder-free wiring.
FIFO Buffer: 10-bit, 32-level FIFO for efficient data handling.
Built-in Features:
Free-fall detection
Motion detection
6D/4D orientation sensing
Embedded temperature sensor
Compact Size: Standard 1in × 1in Qwiic breakout form factor.
Low Power Modes: Power-down, normal, and low-power operation.
