Radxa Heatsink 7012B For Radxa CM3I

Radxa

No reviews yet Write a Review
SKU:
498-AE009B
MPN:
AE009B
Radxa Heatsink 7012B for CM3I module. Compact passive cooling solution for improved thermal performance in embedded and IoT applications. View full description
  • 100% Original Products
  • GST Invoice
  • Earn 3% Cashback
₹869.61 inc. GST
₹736.96 ex. GST
2 people looking at this.

Technical Specifications

Brand:
Radxa
Compatibility:
Radxa CM3I
Material:
Aluminum
Dimension:
70x40x12 mm
Speed:
7000rpm+-10%
Connector:
2-Pin 1.25mm Pitch Connector
Input voltage:
5V DC
Package List:
Heatsink 7012B,Thermally Conductive Paste,CM2x4 Screws

Warranty Information

All the products supplied by Evelta are genuine and original. We offer 14 days replacement warranty in case of manufacturing defects. For more details, please visit our cancellation and returns page.

Description

Resources:
Datasheet

Radxa Heatsink 7012B for CM3I Module with Efficient Thermal Dissipation for Embedded Systems

The Radxa Heatsink 7012B is a specialised cooling solution designed specifically for the Radxa CM3I compute module, ensuring efficient heat dissipation in compact embedded applications. Engineered to maintain optimal operating temperatures, this heatsink improves system stability and performance during continuous workloads such as edge computing, industrial control, and IoT deployments. Its compact design makes it suitable for space-constrained environments while maintaining effective thermal management. Built with high thermal conductivity material, the heatsink enables passive cooling without the need for active fans, reducing noise and power consumption. It is easy to install and aligns perfectly with the CM3I module for maximum thermal contact. This makes it an ideal accessory for developers and system integrators looking to enhance reliability and longevity of their embedded systems.

Key Features

  • Dedicated Compatibility: Designed specifically for Radxa CM3I compute module
  • Efficient Cooling: Provides effective passive heat dissipation
  • Thermal Stability: Maintains consistent performance under load
  • Compact Design: Suitable for space-constrained embedded systems
  • High Conductivity Material: Enhances heat transfer efficiency
  • Fanless Operation: Silent cooling without additional power requirements
  • Easy Installation: Precise fit for secure mounting on CM3I module
  • Application Range: Ideal for IoT, industrial, and edge computing systems